Henkel has commercialized a semiconductor capillary underfill encapsulant to address the requirements of the market’s most demanding advanced packages, like...
Tag - Underfill
Anticipating the requirements for next-generation high-reliability electronics applications, Henkel Corporation announced the development of Loctite Eccobond...
At Apex Expo 2018 at the San Diego Convention Center, February 27 – March 1, 2018, Zymet will be featuring its recently introduced edgebond adhesive...
Zymet, a supplier of adhesives and encapsulants, has introduced UA-3307-B, an edgebond adhesive to enhance board level reliability in automotive and other...
Nordson Asymtek will present the papers „Sealing Dispensing for MEMS Wafer Capping,“ by Heakyoung (Jaynie) Park, and „Wafer Spray Coating for Pre-applied...
Zymet has introduced a new reworkable underfill encapsulant designed to underfill Package-on-Package (POP) assemblies. Compared to earlier generation...
The NF260 delivers increased reliability, creating one order of magnitude over the leading competitor and two orders of magnitude over not using an underfill.
Asymtek has developed an improved method for applying solder-ball reinforcement material to semiconductor packages that can eliminate the need for dispensing...
The Zymet reworkable underfill encapsulant, CN-1531 is designed for CSP and BGA encapsulation, featuring a higher Tg (glass transition point) of 110°C for...
Kester has been awarded a patent for its reflow-encapsulant technology including material and method of use (US Patent 6,819,004). The patent covers the...