Kester has been awarded a patent for its reflow-encapsulant technology including material and method of use (US Patent 6,819,004). The patent covers the epoxy-fluxing technology that enables a no-flow underfill process. Procedure and materials allow for attachment of flip-chip devices to board assemblies without the need for costly underfill-adhesive processes. This novel technique offers board assemblers reduction in half of the number of process steps by eliminating a flux residue cleaning process, and by eliminating the capillary underfill lengthy dispense step and costly capillary underfill post-curing cycle.
EPP EUROPE 420
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