The Zymet reworkable underfill encapsulant, CN-1531 is designed for CSP and BGA encapsulation, featuring a higher Tg (glass transition point) of 110°C for more severe thermal-cycle requirements. CSPs and BGAs are not normally encapsulated. However, it has been found that some portable or handheld devices require encapsulation of these assembled components to survive hard-hitting drop tests, etc. With this reworkable underfill, removal of the defective parts is easily accomplished by heating the component and the underfill encapsulant to 220°C. The encapsulant residues are simply scraped or brushed off afterwards. The material has a viscosity of 5000cps at room temperature, making it undemanding to dispense. The fluid is also fast flowing to up to a distance of 18mm, with only a single-side dispense, in as little as 15 sec. The encapsulant reportedly exhibits excellent wetting. It self-fillets are eliminating the need for seal passes to create complete and symmetrical fillets. CN-1531 can be cured in an in-line oven, in 5 minutes at 165°C.
EPP EUROPE 446
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