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Semiconductor capillary underfill for advanced packaging designs
15. April 2024Henkel has commercialized a semiconductor capillary underfill encapsulant to address the requirements of the market’s most demanding advanced packages,
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Henkel has commercialized a semiconductor capillary underfill encapsulant to address the requirements of the market’s most demanding advanced packages,
At Semicon Taiwan, Henkel showcased a range of semiconductor packaging material solutions designed to foster discussions that will help address
As integrated circuits (ICs) become more dense and complex, particularly in the power device sector, new approaches to die thermal control and electrical
Adhesives manufacturer Henkel has launched an electrically conductive adhesive (ECA) that cures at room temperature. The company says the new product
Henkel announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications. The
Leading adhesive technologies provider Henkel has acquired the Thermal Management Materials business of Nanoramic Laboratories (Nanoramic) headquartered
Leading adhesive technologies provider Henkel has announced the acquisition of the Thermal Management Materials business of Nanoramic Laboratories
Henkel and non-profit innovation centre Chip Integration Technology Center (CITC) have formalized an agreement to collaborate on the development of
Chip Integration Technology Center (CITC) and Henkel announced today that the organizations have formalized an agreement to collaborate on the development
Henkel Adhesive Technologies has announced the release of a new gel thermal interface material known as Bergquist Liqui Form TLF 10000. The one-part high
Transition Automation’s Advanced Permalex squeegees have passed initial trials in a new technology development between Henkel’s Advanced Resins Division
Henkel has announced the launch of a high thermal die attach paste, called Loctite Ablestik ABP 8068TD, developed for use in applications where no die
Expanding its line of automotive grade die attach materials, Henkel has developed and commercialized Loctite Ablestik ABP 8920TC.
The Bergquist gap filler 4500CVO from Henkel combines excellent thermal performance, a high dispense rate and controlled volatility.
Henkel discusses the future of 5G and how vital it is to support this expanding connectivity, especially as Wi-Fi 6 becomes the norm.
Loctite Eccobond LCM 1000AF from Henkel is an encapsulation material that has a anhydride-free resin platform to enable improved warpage control.
Highlighting the breadth of its portfolio, Henkel will show their interconnect, protection and thermal materials for demanding applications at Apex 2019.
Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste.
The Electronics Group of Henkel has appointed Brian Betti as the company’s new Americas Sales Director. Having worked in the electronics industry for over
Henkel showcased powerful solutions spanning the entire value chain. To meet the market challenges, the company develops innovative adhesives and
Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the
Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that
Henkel´s line of materials known as self-filleting die attach reportedly offers all of the benefits of traditional die attach pastes, but takes the
Henkel appointed Luc Godefroid as the company’s global sales director for its semiconductor group. A key member of the electronics sales team since 2001,
Henkel has taken over the adhesive and electronic materials businesses from Akzo Nobel previously owned by National Starch. In 2007, these two segments of
Henkel has announced another materials advancement with the development and commercial availability of Loctite 3536, an advanced underfill material
Henkel has acquired the Taiwan-based Accurus Scientific Co. Ltd, a manufacturer of solder spheres and type 1 through type 7 solder powders with 170
The electronics group of Henkel has introduced a new process, termed Accelerated Cooling (AC), to be used in conjunction with the company’s two premiere,
The electronics group of Henkel has launched the Loctite Bead-on-Bead thermally conductive adhesives products range. Based on proven, proprietary
The electronics group of Henkel has developed and made commercially available a die attach and mold compound material set that is lead-free compatible and