The Thermexit portfolio includes patented, high-performance thermal interface gap pads based on an innovative nano-filler technology. This technology provides unique materials with extremely high thermal conductivity and excellent stability.
The acquisition strengthens the company‘s position in the growing Thermal Interface Material (TIM) market and expands its offerings for applications in high-growing market segments that require specialized know-how with regards to heat management in electronics, including 5G infrastructure, semiconductors, and power conversion for industrial and automotive electronics.
“Thermal management solutions are an important growth technology within our materials portfolio and play a major role to further drive innovations with regards to global megatrends such as connectivity, mobility and sustainability,” explained Jan-Dirk Auris, Executive Vice President Henkel Adhesive Technologies. “The acquisition of Thermexit complements our existing portfolio with offerings in high-growing market segments to further create value for our customers.”
