“This material allows packaging specialists to satisfy the requirement for high heat dissipation in applications where bare silicon die are used, particularly in situations where back-side metallization processes are cost- or process-prohibitive,” Henkel’s Semiconductor Packaging Market Strategy Manager, Raj Peddi, explained. “Because the material is compatible with different die – whether metallized or not – it provides more design and manufacturing opportunities for OSATs and power device developers.”
The new die attach paste extends the benefits of semi-sintering to a wider variety of power packages using different types of die and lead frame finishes. The material has bulk thermal conductivity of 50 W/m-K and was evaluated across several standard testing regimens with bare Si die and Ag-metallized die of various dimensions, up to 5.0 mm x 5.0 mm; as well as on copper (Cu), Ag and pre-plated (PPF) lead frame finishes.
“Already proven in volume production, Loctite Ablestik ABP 8068TD delivers another high-thermal, package-level solution for devices integrating bare Si and/or metallized die, including QFNs, SOTs, and LGAs, among others,” Peddi added. “This is an important development for the power package sector.”
