TRI‘s lineup will include the enhanced 3D SPI TR7007Q SII and 3D AOI TR7700Q SII with a new optical configuration of a 21 MP camera and 9.8 um resolution. The company will also highlight the latest multi-angle 3D AOI, TR7500QE Plus, for hidden solder joint defects as well as the high-speed 3D inline automated X-Ray inspection TR7600 SIII and the high-resolution 3D CT AXI TR7600F3D SII. The company’s optical inspection solutions are powered by AI-algorithms and metrology measurement capabilities.
The IPC APEX 2025 lineup also includes the multi-core ICT TR5001Q SII INLINE with up to 4,096 test points and can handle boards of up to 510 x 510 mm in size. With over 35 years in the market, the board tester ATE solutions range from MDA and functional tests to high-end high-pin count ICTs, making them ideal for multiple electronics manufacturing industries.
The AI-powered solutions include the AI training tool, the AI station, verify host, AI smart programming, and more. The solutions comply with the latest Smart Factory standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
