Formulated specifically for use with today’s fine-pitch advanced CSP and BGA packages, Loctite 3536 is a high flow, lead-free compatible designed to quickly fill the space beneath the CSP and BGA packages. It cures rapidly at low temperature, which minimizes thermal stress to other components on the printed circuit board (PCB) and allows for in-line curing to increase device throughput.
Today’s hand-held devices are subjected to many stresses and require reinforced mechanical strength for long-term reliability. The underfill material delivers superior protection for solder joints against mechanical strains such as shock, drop and vibration and testing confirms its protective superiority over that of competitive materials. When evaluated against JEDEC drop test standards on 0.4 mm and 0.5 mm Pb-free devices, Loctite 3536 was proven to have nearly five times the reliability over non-underfilled Pb-free devices. The material also offers exceptional manufacturing flexibility, as it is compatible with lead-free solder materials to allow for an increased process window and is reworkable, enabling the recovery of expensive substrates and PCBs.
EPP Europe 428
