In celebration of emerging trends in electronics miniaturization, the company has declared 2025 the “Year of Type 5”. It’s decades of experience producing high-quality solder pastes optimally positions the company to guide customers through the transition to finer powders. Although Type 5 solder paste is unlikely to replace Type 4 as the industry standard in 2025, its adoption is accelerating.
At the event, Gayle Towell of the company will be holding a technical presentation titled “Exploring the Feasibility and Challenges of a Low-Temperature Alloy in Wave Soldering Applications.” Scheduled for 4 PM on Tuesday, October 21, the presentation will evaluate the performance of a SnBi-based LT alloy in wave soldering across different metrics. The results include careful examination of thermal profiles, wetting performance, and overall solder joint quality including cross sections. Furthermore, the presentation will provide insights into the practical application of a select LT alloy in wave soldering, offering PCB assemblers information into their potential for broader use in the electronics manufacturing industry.
The company’s products and services will be exhibited at Booth #2618.
