Founded in 1998, the firm’s patented solder sphere manufacturing technology and the product quality that has resulted have catapulted the ISO 9001 and ISO 14001 certified company to market-leading status. Created through a mechanical jetting process as opposed to the conventional machine cutting or punching procedure, its solder sphere production and subsequent automated sorting method reportedly yield spheres that are of high quality and deliver very good performance. Ranging in size from 0.08 mm to 1.9 mm in diameter, the solder spheres produced through this manufacturing process deliver numerous benefits including better co-planarity, higher yields, low contamination and unmatched quality assurance. “Undoubtedly, Henkel is established as the leading provider of inter-device packaging materials with die attach, underfill, liquid encapsulants and mold compound products at the top of their respective categories”, states Patrick Trippel, President of the electronics group of Henkel. “
Accurus’ product range now enables the extension of our portfolio to include the solder spheres used for BGA and CSP package to board interconnection, and gives customers a single-source materials supplier. Furthermore, the fine-particle, type 5, 6 and 7 solder powder capability expands our alloy offering and process technology for the entire semiconductor and PCB assembly value chains.”
’The manufacturer’s location being in Tainan, Taiwan, it further widens the parent company’s global manufacturing, sales and technical support infrastructure. Over the last two years it has invested heavily in the Asia-Pacific region, opening facilities throughout the burgeoning geography.
“I can think of no more suitable parent company than Henkel to ensure the uninterrupted product advancement and resource investment required to expand our technology roadmap, and enable the continued development of solder materials for the most sophisticated devices”, comments Henry Wang, CEO of Accurus Scientific.
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EPP Europe 408
