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    Low silver alloy promises cost savings

    Low silver alloy promises cost savings

    8. Juni 2026

    AIM Solder has announced its participation in the upcoming SMTA Ontario Expo and Tech Forum, taking place on June 16 at Venu Event Space in Vaughan,

    Connect, Collaborate, Launch event set for July

    Connect, Collaborate, Launch event set for July

    4. Juni 2026

    Advanced Rework Technology (A.R.T.), one of Europe’s longest-running IPC Certification Centres, has partnered with Space East to host the Connect,

    Introducing the world’s first auto kitting station

    Introducing the world’s first auto kitting station

    3. Juni 2026

    FUJI Corporation, headquartered in Japan, has developed the Auto Kitting Station, a new system unit that automates the loading of component reels into

    Collaboration to advance silicon design enablement

    Collaboration to advance silicon design enablement

    3. Juni 2026

    Siemens has announced the latest continued collaboration with Samsung Foundry, reinforcing joint efforts to enable advanced semiconductor design and

    35 years of innovation from Jena, Germany

    35 years of innovation from Jena, Germany

    2. Juni 2026

    35 years of innovation from GÖPEL in Jena, Germany

    PCB trade fair shows industry resolve

    PCB trade fair shows industry resolve

    29. Mai 2026

    A trade fair in Italy focusing on PCB design and assembly has concluded with the message that AI, skills shortages and supply chain resilience are

    New set of configurable switch matrixes

    New set of configurable switch matrixes

    28. Mai 2026

    Saelig Company has announced the EECL SMX range of configurable switch matrixes for signal up to 30GHz with up to 8 common ports and 48 switched ports.

    SMT manufacturer growth to benefit UK customers

    SMT manufacturer growth to benefit UK customers

    27. Mai 2026

    Altus Group has highlighted the customer benefits of YJ Link’s continued global growth, as the manufacturer of SMT board handling equipment, laser marking

    Global Electronics Association launches new global council

    Global Electronics Association launches new global council

    26. Mai 2026

    The Global Electronics Association has announced the formation of the Global Electronics Policy Council (GEPC), a new body uniting leading electronics

    On show in Nuremberg: Smart mobility

    On show in Nuremberg: Smart mobility

    22. Mai 2026

    At PCIM Expo 2026, which took place last week in Nuremberg, Germany, ASMPT Semiconductor Solutions presented technologies for modern power electronics and

    New versatile addition to test boards lineup

    New versatile addition to test boards lineup

    21. Mai 2026

    Magnalytix, a provider of real-time reliability solutions for electronics manufacturing, has introduced a new advancement in electronics reliability

    AOI–autonomous inspection as a key enabler

    AOI–autonomous inspection as a key enabler

    20. Mai 2026

    With the presentation of AISPECTURE AOI, the “World’s first true unsupervised inspection”, the ASYS Group aims to set a new technological benchmark in

    The “Factory of the Future” returns

    The “Factory of the Future” returns

    14. Mai 2026

    Altus Group, a leading distributor of capital equipment for electronics manufacturing in the UK and Ireland, has announced the return of its ‘Factory of

    Reducing workload, retaining expertise

    Reducing workload, retaining expertise

    13. Mai 2026

    AI Judgement Station applications can learn from the best human inspectors and support the less experienced, becoming both an automation solution and a

    New distribution agreement for UK, Ireland

    New distribution agreement for UK, Ireland

    12. Mai 2026

    ITW EAE has announced the appointment of AMS as the authorized distributor of MPM Printer and Camalot Dispenser products for the United Kingdom and

    New solder paste series for high-speed jetting

    New solder paste series for high-speed jetting

    11. Mai 2026

    Essemtec has announced the successful qualification of a new dedicated solder paste series for high-speed jetting, developed in close collaboration with

    Faster, safer, easier changeovers

    Faster, safer, easier changeovers

    7. Mai 2026

    Esmo group, a global full-service systems integrator, developer, and supplier of advanced automation solutions for the semiconductor test industry, has

    New agreement to broaden UK distribution

    New agreement to broaden UK distribution

    11. Mai 2026

    Saelig Company has announced that it has been appointed an authorised distributor for European Engineering & Consultancy (EECL) of Kingston, UK. The

    SMT production technology: What really matters

    SMT production technology: What really matters

    6. Mai 2026

    In today’s electronics manufacturing, what matters most is real performance, consistent quality, flexibility, and long-term investment protection.

    Forming the answer to test efficiency

    Forming the answer to test efficiency

    6. Mai 2026

    In testing high-end electronics during the production process, conventional test pins are reaching the end of the road: electronic designers require more

    Napino: electronics as a driver of success

    Napino: electronics as a driver of success

    6. Mai 2026

    Napino Auto & Electronics is one of India´s leading manufacturers of automotive electronics. Since its foundation in 1997, the company has developed from

    Decisions

    Decisions

    6. Mai 2026

    Frederick RindleEditor-in-chief EPP and EPP Europefrederick.rindle@konradin.de A machine executes, a human decides – that was the unspoken agreement on

    APEX EXPO 2026 celebrates sold-out event

    APEX EXPO 2026 celebrates sold-out event

    6. Mai 2026

    Held in Anaheim, California in March, APEX EXPO by the Global Electronics Association marked a defining moment for the global electronics industry. Being

    When mechanics become yield-critical

    When mechanics become yield-critical

    6. Mai 2026

    Advanced packaging has created new process bottlenecks related to the internal mechanics of packaging equipment. As alignment tolerances compress from

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