The sold-out event featured a myriad of highlights. For many attendees, it was the newly evolved technical conference. The revamped conference program debuted under the title Advanced Electronic Packaging Conference 2026 and reflected the industry’s accelerating shift toward end-to-end, component-to-system-level integration, linking materials, interconnects, architectures and finished systems. More than 80 peer-reviewed technical papers were presented across 25 sessions, delivering practical insights and cutting-edge research focused on performance, reliability and innovation across the electronics ecosystem.
Attendance at the event reached 7,192, a 4% year-over-year increase. With 3,691 verified participants, the event welcomed professionals from 50 countries, reinforcing APEX EXPO’s position as a premier international gathering for the electronics industry. The sold-out exhibition floor featured 417 exhibitors over 140,000 net square feet, representing a 3% and 5% increase, respectively.
The event featured a myriad of highlights. Hands-on learning and thought-provoking discussions were held across 25 sessions and 7 technical tracks dedicated to content spanning next-generation technologies, sustainability, and design innovation.
At the reimagined Advanced Electronic Packaging Conference, more than 80 peer-reviewed technical papers were presented across 25 sessions, delivering practical insights and cutting-edge research focused on performance, reliability and innovation across the electronics ecosystem.
“APEX EXPO 2026 reflects how rapidly our industry is evolving, from discrete manufacturing steps to fully integrated electronic systems,” commented John W. Mitchell, President and CEO of the Global Electronics Association.
Mitchell added: “This year’s conference brought together the people, technologies and ideas that are defining the future of electronics, and it did so at a scale and depth that is unmatched anywhere in North America.”
The conference opened on Monday, 16 March, with two keynote presentations that set the technical and strategic direction for the week. Dr David Lokken-Toyli of IBM explored how packaging and SMT enable next-generation compute platforms, ranging from heterogeneous integration to quantum systems. This was followed by Dr Ravi Mahajan of Intel, who discussed advanced packaging as a critical enabler for interconnect scaling and highlighted the importance of collaboration between industry and academia.
Later in the week, two special sessions focused on sector-specific requirements driving innovation in advanced packaging: Advanced Electronic Packaging for Aerospace and Defense Electronics, and The Future of EV and Automotive Electronics. These sessions examined how packaging technologies are increasingly being engineered to meet stringent reliability requirements, long product life cycles, and demanding thermal and environmental conditions.
The 2026 programme also featured technical contributions from major industry players, including AMD, Collins Aerospace, Hyundai Mobis, IBM, Intel, Lenovo, Qualcomm, Raytheon Technologies Corporation, Robert Bosch, The Aerospace Corporation and Toyota Motor Corporation.
According to Mitchell, the enhanced technical programme, expanded exhibition floor and new on-site experiences made this year‘s fixture the most comprehensive and integration-focused event in the conference’s history.
New additions for 2026 included the Design Village and Technology Pavilion, which highlighted advances in design and simulation from advanced packaging through to system-level integration.
Record participation
The event marked the largest manufacturer lineup at the event in six years. This reflected strong demand across the global electronics manufacturing supply chain and provided attendees with comprehensive access to suppliers representing the entire electronics value chain.
Exhibitors showcased solutions ranging from PCB fabrication and advanced electronic packaging to
assembly equipment, materials, test and inspection systems, automation technologies, design software and supply chain services. More than 150 product launches were presented during the event, alongside live smart-factory demonstrations and new standards initiatives.
According to Alicia Balonek, Senior Director of Tradeshows and Events at the Global Electronics Association, the strong exhibitor participation underscored the electronics manufacturing industry’s current momentum. “A sold-out show floor demonstrates that companies view APEX EXPO as a critical venue for launching innovations, strengthening partnerships and driving business growth. For attendees, it means maximum exposure to the technologies and suppliers shaping the future of electronics manufacturing,” Balonek said.
Among the highlights were smart-factory interoperability demonstrations featuring IPC CFX and Hermes standards, enabling visitors to observe real-time data flows and production integration scenarios. In addition, professional training sessions, certification courses and leadership-focused programs such as the EMS Leadership Summit addressed key topics including capacity planning, supply chain resilience, sustainability and workforce development.
Rapid advancements on the exhibition floor
The exhibition in Anaheim once again underscored how rapidly electronics manufacturing is evolving, with exhibitors emphasizing intelligence, automation, and precision.
One of the most prominent themes was the rise of AI-enabled manufacturing execution and intelligence platforms. This was evident in solutions such as the Industrial Operations Platform from Critical Manufacturing, which is designed to unify production data, enabling real-time monitoring, predictive analytics, and adaptive process control. Such solutions go beyond traditional MES functionality by incorporating machine learning to optimize SMT and electronic component throughput and reduce defects dynamically. The implication is clear: manufacturers are moving toward self-optimizing factories where decisions are increasingly automated and informed by live data streams.
Complementing this shift, advanced process verification technologies showcased how quality assurance is becoming more proactive than reactive. New systems, such as the VP10 Thermal Profiler from Solderstar, integrate verification directly into the production workflow, ensuring that each step is validated before moving forward. This approach minimizes costly rework and aligns with the broader push toward zero-defect manufacturing. It also reflects growing customer expectations for traceability and reliability, particularly in high-reliability sectors such as automotive and aerospace.
Material handling and storage innovations were also on display, including Inovaxe’s new ultra-high-density smart storage system for SMT and electronic components: InoHD. The solution addresses the increasing complexity of component management by combining compact storage with intelligent tracking and environmental control. By automating inventory handling and ensuring optimal storage conditions, such systems help reduce material waste and improve production efficiency—critical factors as component miniaturization and supply chain volatility continue to challenge manufacturers.
Rework and component counting technologies further illustrated the industry’s focus on precision and efficiency. New rework systems are designed to handle increasingly delicate and densely packed assemblies, offering enhanced thermal control and repeatability. Meanwhile, advanced component counting solutions leverage imaging and AI to deliver faster and more accurate inventory management, reducing human error and supporting just-in-time production models.
Inspection technologies remain a cornerstone of innovation, with the latest AOI and 3D X-ray systems pushing the boundaries of detection capability. In Anaheim, attendees experienced solutions such as OMRON’s new 3D CT X-ray (AXI) systems for true 3D inspection of hidden solder joints. The inspection solutions on show offered higher resolution, faster processing speeds, and improved defect classification through AI-assisted analysis. The integration of 3D imaging provides deeper insight into hidden solder joints and complex assemblies, reinforcing the trend toward comprehensive, inline inspection that can keep pace with modern production demands.
Process reliability and precision control were also key focal points. New equipment emphasizes tighter control over variables such as temperature, placement accuracy, and process consistency. This reflects the increasing sensitivity of modern electronic assemblies.
Finally, materials innovation continues to play a crucial role. The introduction of AIM Solder’s REL61 alloy, a cost-saving, low-silver solder solution, highlights the industry’s effort to balance performance with economic and supply considerations in the development of new materials. Increasingly, the aim here is to maintain reliability while reducing dependence on expensive raw materials, an important factor in today’s fluctuating global markets. Taken together, the innovations on site pointed to a manufacturing landscape that is becoming more intelligent, interconnected, and resilient, boosted by the convergence of AI, advanced inspection, smart logistics, and material science.
Next year‘s event, APEX EXPO 2027, is scheduled for April 3–8 in Anaheim, California.
