The E170DN-ESS series has been specifically engineered and validated for Essemtec’s high-speed solder paste jetting technology, achieving outstanding performance at jetting speeds of up to 1.1 million dots per hour. This qualification marks an important step in expanding material options for next-generation electronics manufacturing.
Designed for advanced jetting applications
The E170DN-ESS series introduces two optimized variants, Type 5 and Type 6, tailored to meet different levels of precision and application requirements:
- S3X70-E170DN-ESS (Type 5) with a particle size of 10–25 μm, offering a robust balance between speed and reliability; and
- S3X811-E170DN-ESS (Type 6) with a finer particle size of 5–20 μm, enabling enhanced precision for fine-pitch and advanced packaging applications.
Both formulations are based on a Sn3.0Ag0.5Cu alloy and are designed to ensure consistent, repeatable jetting performance in demanding production environments.
Engineered for stability at high speeds
Designed for non-contact jet dispensing, the E170DN-ESS series combines optimized powder size, viscosity, and carefully controlled rheology to deliver optimum process stability.
Even at very high jetting speeds, the material ensures accurate dot formation and placement, while eliminating common challenges such as clogging, splattering, or solder defects. This level of performance is essential for fine-feature applications, irregular geometries, and 3D assemblies, where traditional processes can be a limiting factor.
Collaboration driving material and process excellence
The development and qualification of the series are the result of close collaboration between Essemtec and KOKI, with a strong focus on aligning paste formulation with jetting performance requirements.
By optimizing key parameters such as rheology and material behavior under high-frequency jetting conditions, the teams were able to validate solder paste solutions that fully leverage the capabilities of Essemtec’s platforms. This collaboration ensures that customers benefit from a perfect match between material and equipment, even in the most demanding applications.
Greater flexibility through expanded material options
With the introduction of the E170DN-ESS series, Essemtec significantly broadens the range of solder pastes qualified for its high-speed jetting solutions. This advancement gives customers greater flexibility to select materials that best match their specific applications, production strategies, and supply chain requirements. It enables manufacturers to adapt more easily to evolving product designs while maintaining high process stability and performance. Ultimately, this expanded compatibility reflects Essemtec’s commitment to delivering solutions that place customer needs, process adaptability, and long-term efficiency at the center of innovation.
Jetting: complementing or replacing stencil printing
High-speed solder paste jetting offers a powerful level of flexibility in modern electronics production. It can be seamlessly integrated alongside traditional stencil printing as a complementary solution.
At the same time, for high-mix, low- to mid-volume production, jetting can fully replace stencil printing by eliminating the need for stencils, reducing setup times, and enabling faster changeovers. This approach allows manufacturers to respond more quickly to changing production demands while maintaining high accuracy and repeatability.
Meeting environmental requirements
The E170DN-ESS series is halogen-free and compliant with modern environmental standards, supporting manufacturers in meeting increasingly stringent regulatory and sustainability requirements without compromising performance.
