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Applications

Printing and assembly challenges for quad flat no-lead (QFN) packages
Overcoming the difficulties

Flat no-leads packages such as QFN (quad-flat no-leads) and DFN (dual-flat no-leads) are becoming more popular in new component releases. Their very small form...

Reliable soldering results in high-mix/low-volume production
Flexibility as a top priority

Murrelektronik was founded in 1975 by Franz Hafner, who is still strongly rooted in the company today. The company‘s headquarter and production plant in...

Vacuum reflow: A simple approach for void reduction
Increased process capability

Conti Temic Microelectronic GmbH in Nuremberg specialises in the manufacture of highly complex electronic assemblies for the automobile industry. Soldered...

Not just for test, but for programming and debugging too
The attraction of boundary scan

Since its release in 1990, the IEEE JTAG standard has driven the development of many easy to use and highly automated tools for boundary scan testing.These...

LED failure modes and methods for analysis
Providing the requirements

LED’s open the way to new applications and markets in various different fields with a broad spectrum of requirements. Beneath other benefitial...

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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2024
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