Despite the growing challenges it is facing, conformal coating is becoming more and more important. As printed circuit boards become smaller and smaller, the...
Applications
In this article we share the solution for the elimination of head-in-pillow (HIP) defects in the package-on-package (PoP) assembly process by engineering...
Solar cell substrates are delicate. The manual soldering process applies stress to the material which can cause micro-cracks to form. Here, we identify the...
A number of trends in printed circuit board (PCB) assembly demand a wider process window in selective soldering. We have the “traditional” technology...
Paste-in-hole (PIH) printing, a.k.a. through-hole printing, pin-in-paste, intrusive reflow, etc., has always been a way to accommodate traditional through-hole...
