Indium Corporation’s BP-3106 solder paste produces large deposits of material in BGA bumping and other applications using only an SMT printer with a bumping stencil. The paste is applied using existing equipment, allowing the flexibility of increasing the throughput by increasing the BGA substrate panel size and printing speed without extra investment in expensive equipment, such as BGA ball placement hoppers. This material has reportedly excellent release properties, robust slump resistance and ultra-low voiding. It can be used for both area array and peripheral BGAs and passes SIR before and after cleaning. Standard packing includes 500g jars and 700g Semco cartridges. In addition, the paste can be applied for enclosed printheads such as DEK’s ProFlow and MPM rheo pump.
EPP EUROPE 441
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