Elektrobit had displayed the Odd Shape Cell J504–05 at the SMT/Hybrid/Packaging 2006 exhibition and conference in Nuremberg, Germany. J504–05 is an...
Applications
For companies that have a small to medium production series of many different kinds of PCBs, a flexible pick & place machine is a must. Together with rapid...
Cookson Electronics Assembly Materials has announced the launch of its Alpha OM-338 PT lead-free no-clean solder paste. This new product is said to offer...
The flip-chip bonder AFM-15 offers significantly faster bonding at 1.1s per chip (including bonding time), compared to the nearest comparable method of...
Palomar Technologies’ Model 8000 is a gold ball-and-stitch thermosonic wire bonder for complex, precision gold wire bonding applications where flexibility...