Palomar Technologies’ Model 8000 is a gold ball-and-stitch thermosonic wire bonder for complex, precision gold wire bonding applications where flexibility, ease of programming, and high throughput are desired such as complex multichip applications, high I/O count devices, and gold ball bumping for flip chip with planarBump technology.
The Bonder incorporates a large area 12” x 6” (300 mm x 150 mm) x-y range linear motor actuated positioner carrying a dual axes voice coil driven bond head with a rectilinear z-stroke of 800 mils (20 mm). The Windows-NT software provides the user with a rich programming environment for multi-chip, high pin count applications while incorporating many in-process monitoring tools such as real-time deformation monitoring to track set down on each individual bond. The large work area accommodates dual handling systems for virtually zero-wait-state indexing and maximized throughput.
“The model 8000 represents the latest advances in gold wire bonders, incorporating leading-edge mechanical design, control architecture, and graphical user interface to provide the highest net throughput and flexibility of any comparable tool on the market today,” commented Palomar’s President, Bruce W. Hueners.
The Bonder can also be configured as a single process co-planar gold bumper. It is the only gold bumper that can produce planarized gold bumps in one step. An industry-best finished bond height consistency of +2 microns (at 3 sigma) is achieved with better than 5-micron placement accuracy. Gold wire is used for a lead-free process. The process runs automatically at a cyclical rate of >10 bumps-per-second, enabling even large I/O die to be completed rapidly.
EPP EUROPE 433
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