The 2011 iNEMI Roadmap is the most comprehensive roadmap published to date by the International Electronics Manufacturing Initiative. The 1800-page document, created by individuals representing all aspects of the electronics manufacturing supply chain, features 27 chapters that provide in-depth discussion of six product sectors and 21 different manufacturing, component/subsystem, business process and design technologies. The more than 575 individuals who contributed to the 2011 Roadmap represent over 310 corporations, consortia/associations, government agencies and universities, located in 18 countries. New in this edition is a combined chapter on MEMS and sensors. Sensors have been covered in previous roadmaps, and MEMS technology has been discussed in several chapters; however, this is the first time that MEMS technology has been discussed as a standalone topic. Also this cycle, the Packaging chapter was expanded to include discussion of component substrates.
“This latest roadmap represents more than six man-years of work by people who are ‘in the trenches’ of electronics manufacturing,” said the CEO Bill Bader. “We have also continued to increase the number of participants outside of North America for a truly global view of this international industry.”
Two topics are 3D packaging and component traceability, both of which have broad-reaching effects. Increased momentum in the move toward 3D packaging creates issues up and down the supply chain, affecting assembly processes and equipment, design and simulation tools, reliability methodologies, thermal management strategies and cooling technologies, and test and inspection strategies. There is a growing need for product traceability and product data reporting. which is driven by increased concerns about, and occurrence of, counterfeit parts; legislation to prevent trade in “conflict minerals” from the Democratic Republic of the Congo; expanding environmental legislation banning “materials of concern,” which compels companies to require detailed product data attributes; plus requirements for medical OEMs to maintain traceability of critical bill of material components as well as the final product.
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