The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) was a major success, marking a significant milestone in the field of advanced packaging and system integration.
The three-day event, held in Berlin, Germany, attracted 430 delegates from 27 countries, bringing together professionals with diverse expertise in technology development and industrial management. Attendees contributed to the event with four keynote speeches, 117 oral presentations, and 46 posters, sharing their extensive knowledge and insights during sessions and networking opportunities.
Program highlights
- Three Professional Development Courses (PDCs) held prior to the conference
- The IEEE EPS Heterogeneous Integration Roadmap Workshop
- Five Special Sessions covering topics such as IPCEI ME/CT, Education, Photonic Packaging, and Quantum Technologies
- Panel Discussion on “Chiplets for Automotive”
A memorable highlight of the conference was the dinner at the iconic Wasserwerk, where attendees enjoyed fine dining amidst the breathtaking views of the illuminated historical water pump station—a perfect setting for informal discussions and networking.
Awards
Special congratulations go to the winners of this year’s Best Paper Award, Charles Bon-Mardion and his team, for their outstanding work on “Superconducting Superlattice Interconnects for Cryogenic Systems.” Additionally, Nyake Gahein-Sama and his team received the Best Poster Award for their research on “Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications.” The awards were presented by Program Chair Toni Mattila and Poster Chair Karl-Friedrich Becker, respectively.
IEEE ESTC 2026 will be held in Helsinki!
Keynotes
The first two keynotes are now available for download by visiting the ESTC website.
