Cookson Electronics Assembly Materials (CEAM) have recently hosted an informative Automotive Electronics Technology Day attended by 50 engineers and executives at the ZVE Training Center in Oberpfaffenhofen, Germany. This technical forum included keynote presentations by speakers from Seho, Siemens Corporate Technology, Lackwerke Peters, EADS and Cookson Electronics. The presentations were followed by very active question and answer open forums. The primary topics discussed centred on the challenges faced by automotive electronic assemblers in the transition to lead-free soldering processes. Although exempted from EU RoHS legislation, many in the automotive segment are moving rapidly towards lead-free production. “We received very positive feedback from attendees at our Automotive Electronics Day,” said Markus Schmidt, Cookson’s Global OEM Manager. “All of our speakers, including Professor Dr. H. J. Albrecht of Siemens Corporate Technology, Dr. M. Suppa of Lackwerke Peters and Thomas Lauer of EADS, shared important information with our attendees. Their focus was on the challenges faced by the automotive industry as it prepares to convert to the production of highly reliable lead-free electronic assemblies.” The company is planning to host additional Automotive Days in the future. Information regarding dates and locations will be available soon at their website.
EPP Europe 410
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