Asymtek has sold a Spectrum S-910N dispensing system to DancoTech, located in Ballerup, Denmark – their eleventh Asymtek unit and second Spectrum 900 series platform. DancoTech selected the S-910N platform for its slim footprint (600mm wide), its flexible, scalable configuration, and precision-dispense capability. “We have chosen Asymtek for our dispensing requirements because of their deep knowledge and expertise in automated fluid dispensing,” said Pernille Louise Vinten, Production Technology Manager for DancoTech. “Our new Spectrum S-910N systems give us more capability in a smaller footprint, saving valuable space on our production floor.”
“Shipping the 11th dispensing system to DancoTech is a key milestone for Asymtek,” states Asymtek’s Global Account Manager, Lars Nielsen. The Spectrum S-900N Series dispensing system is designed with maximum flexibility, configurable for a wide variety of applications. It can handle high-volume applications, such as edge- and corner-bonding that do not require heat, and can be configured with up to three heat stations for applications that require heat, such as flip chip and CSP underfill. With its scalable configuration, the Spectrum S-900N platform can be configured with single or dual lanes depending on capacity requirements. As process needs change, the system can be upgraded to add options not previously required.
DancoTech, a member of WDH Group, is focused on the development and production of microelectronic components with expertise in chip stacking, fine-pitch wire bonding, flip-chip and fine-line surface mount adhesive device applications.
EPP EUROPE 415
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