Small batches and prototypes of assembled SMD boards can be mounted quickly and accurately using the Expert-SAFP semiautomatic pick-and-place system from Essemtec. The pick-and-place head is air suspended, and moves gently and ergonomically, allowing fast and accurate work. When the component structure moves to fine-pitch or if a manual alignment is not possible (BGA, micro-BGA, flip chip), the integrated vision and placement system MPL3100 can help. Its double prisma optical system can display the component and the substrate overlay on one screen. Alignment and placement is then easy and the large zoom range of the optic enables a highly accurate result. The placement system is suited for prototyping because it allows components to be picked from both reels and sticks, and from rest tape strips as well as loose components. A turning station for upside down components is standard on the system. Because fast and precise placement is a basic requirement in small batch manufacturing, the placement system can be connected with computer controls and works in a semiautomatic mode. Placement data can be converted directly from the CAD file or thought point by point. The Windows control software increases productivity and ensures that the correct component is correctly aligned at the desired place without errors. The placement system is available as a complete prototyping station, including a dispenser and a reflow tool.
EPP Europe 437
Share:
