The Finetech module Sonic Void Reducer supports the wire-bonding or soldering process, as it allows the significant reduction of gas or air inclusions (voids) in the contact layer, and thus provides better joints. The quality of an electrical connection is a decisive factor for circuit reliability. Preventing voids in development by exact control of the process parameters is difficult and uneconomical. Further, it is not possible to raise temperature and force to drive off air inclusions, because reduced reliability is a possible result. With the tool, the number of remaining voids can be reduced significantly. Its ceramic oscillator puts the substrate support into resonance. The generated surface-acoustic waves are of very small amplitude and low frequency, and thus their influence on placement accuracy can be ignored. The gas or air molecules start to move away in the direction of lower pressure. As soon as the joining materials come into mechanical contact, existing oxide and scale layers are penetrated. This way, inclusions are taken to the periphery where they can escape. Improved wetting causes a significantly better quality and capability of joints, be they bonded or soldered. The tunable frequency extends the field of application, as it allows a reaction on changing conditions given by substrate and joining process.
EPP EUROPE 444
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