The NF260 delivers increased reliability, creating one order of magnitude over the leading competitor and two orders of magnitude over not using an underfill.
Designed for Pb-free assembly, NF260 is fully compatible with the SMT process and offers a wide process window to accommodate solder reflow and underfill curing. The underfill curing is completed in one reflow pass and no post-cure is required. NF260 reduces costs when compared to capillary flow underfills, and also achieves higher yields.
What sets this product apart is its impressive durability in thermal cycling (>2,500 cycles with no failures) and in thermal shock testing. NF260 surpassed endurance expectations, with no failures after more than 450 drop tests. Under similar conditions, unfilled soldered connections typically fail after fewer than 10 drops.
EPP EUROPE 437
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