Quality instead of quantity

With more than 50 years of experience Delo has established itself as a successful provider of tailor-made adhesives. Our core competence is the light-curing of adhesives – components are bonded within one to two seconds by means of light. Today it is applied in sectors like electronics and microelectronics, in the chip card technology and by automotive suppliers. And the demand is steadily growing. One can find Delo adhesive in every second mobile phone worldwide by now. But also microchips in EC-cards are being protected and mini-loudspeakers are being assembled with our adhesives.

We do not only supply tailor-made adhesives and the corresponding lamps and dispensing systems, moreover we focus on an extensive technical advice and support for our customers. We give our customer a full-service support and take a very close look at his corresponding production process. Thus, Delo supports from the early planning phase to the implementation in the running production. Our credo: Quality instead of quantity. In order to stay competitive we invest in innovation. 10 percent of our turnover is invested in research and development. 43 percent of our turnover is gained by products which we have developed during the past five years.

Delo is continually growing on all levels – higher turnover, more employees and spatial growth. We are very proud of this! For the current financial year that successfully ended on March 31st, we were able to increase our turnover by 14 percent: For the first time we have surpassed the 30 million euro mark and achieved a turnover of 30.6 million euro. In order to be able to further expand, we also need masterminds who work on their own authority and are willing to highly engage themselves. With 210 employees we have reached a new record regarding manpower. In the last financial year alone we hired 55 employees. As a result, we also expanded spatially in the past year: Since September modern production plants, development laboratories as well as training facilities and offices are to be found in our new company building on a total area of 25,000 m². With this we have increased our spatial capacity by 2.5 times! This makes clear: Not the fast gained money, but a long-term, healthy and profitable growth is our topmost priority.

We multiply interesting and profitable application areas to markets which are interesting for us – for example adhesives for the smart card sector in Europe to Asia. This strategy bears fruit: As a worldwide supplier of niche applications we put our special focus on countries where we can gain a market share of more than 50 percent. In Asia we concentrate on the smart card and smart label market, in the US on adhesive applications in the RFID sector and in Taiwan and Korea on applications in the OLED technology. Like this we also position ourselves as a niche supplier for innovative technologies. Our device: We are where our customers are.

Just now we have established an American subsidiary and sent out one of our German engineers. Our goal is to get a foot in the door on the crucial American market and serve our customers there even better. We have observed that the personal customer contact with a substantiated and competent support is extremely important there – the Americans do not seem to have been too spoiled in this field in the past.

Our customers deservedly expect the close and direct contact with the manufacturer and most of all the best support as fast as possible. Therefore, we have a global network: Regarding the fast growing Asian markets we have established own representative offices in Shanghai and Singapore and have own Sales Engineers in the UK, the Benelux countries and Italy. Moreover we are cooperating with technically highly qualified distributors all over Europe and through them serve our customers from various sectors – starting with electronics and microelectronics over automotive to mechanical engineering. Our foreign distributors and employees further extend the direct contact with our customers, discuss the customer’s specific applications and are the important interfaces to the Engineering Department and Product Management in Windach. Additionally, our distributors also offer customer-specific trainings and seminars in the particular countries dedicated to special questions of bonding technology.

An important challenge for us is the current trends in technology: In electronics the tendency clearly goes to miniaturization of modules, components and finished products. Adhesives are perfectly suitable to bond miscellaneous materials on a minimum of space in a fast, secure, permanent and economical way – for example in the flip-chip technology. The increasing miniaturization therefore means to us: Bonding is gaining more and more importance. At the same time the demands on the adhesives are rising, for example when they are being implemented in high-reliability applications in the chip encapsulation technology. The fine structures on the chips and wires can only be protected against mechanical impacts and environmental influences by means of suitable compounds. A further challenge: As even shorter cycle times and an economical realization of the assembly process are becoming more and more important, processing times have to become shorter as well and the adhesives have to cure faster. All things considered: The demand for our adhesives for special applications is steadily growing, but they have to be continuously further developed. With our innovation rate of 10 percent regarding research and development, we are far ahead of the sector’s average and are therefore excellently prepared for the future.

EPP Europe 417