Speedline Technologies has developed several important lead-free upgrades for its line of Electrovert wave-soldering systems, including the UltraFill nozzle and quick-change solder pot. 40% wider than the traditional tin-lead nozzle, they increase both contact length and dwell time, and are placed closer together to reduce the temperature drop between them. This way, less superheat is needed to reflow solder joints in the second wave, improving hole fill and reducing bridging. Moreover, there’s no requirement to slow the conveyor and dross generation is reduced. The nozzles are available in Melonite corrosion-resistant stainless steel or titanium designs. An optional nitrogen shroud is available. The shroud allows for either air or nitrogen operation, without the need to change nozzles. The shroud both encompasses the nozzles in the pot and reduces dross formation in nitrogen environments. The shroud lifts for easy maintenance and dedrossing – without nozzle removal. The quick-change solder pot provides the capability to easy switch between two alloys, such as between tin-lead and lead-free solders, providing significant savings versus a traditional manual changeover. The unit includes a second solder pot with motors, pumps, flow ducts, nozzle and 2 trolleys. Both upgrades are available as an option on new or existing EconoPak Gold, Electra and Vectra soldering systems. Other upgrades include: high-velocity convention topside preheater (tighter Delta T’s across a board); reciprocating spray fluxing for precise deposition, improved through-hole penetration and low maintenance requirements; and Vectaheat bottom-side preheater, for even high thermal-mass heating.
EPP EUROPE 417
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