The electronics group of Henkel has developed and made commercially available a die attach and mold compound material set that is lead-free compatible and specifically designed for thin and ultra-thin surface mount device (SMD) applications. Combined, the Hysol QMI529LS die attach material and Hysol GR828A mold compound deliver the thin materials properties necessary to provide a robust material set solution for packages used in today’s low-profile products. When manufacturing TSOP, TSSOP and TQFP packages with Au-plated and Ag-plated lead frames, use of the die attach adhesive with the “Green” mold compound produces superior material set reliability and performance. The die attach’s formulation provides hydrophobic properties, while delivering stability at high temperatures. Materials properties of the mold compound exhibits gate leakage performance. Extensive testing of this materials combination to JEDEC Level 1, 260 °C has confirmed its robust performance.
EPP EUROPE 443
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