LPKF announces the newest version of the MicroLine 350D, a compact, versatile laser system designed especially for cutting and drilling flex circuits, cover foils, and ceramic substrates.
The system is precise and fast, efficiently cutting even the most sensitive material. It is designed to reduce processing time and down-time, increasing overall productivity. The laser produces finer work than a mechanical system as well, combining extreme precision and the finest cutting capability to produce the most compact circuit layouts.
The product includes a custom software suite designed to maximize all functions, from data preparation to full control of the machine. The software imports virtually every file type and offers complete control over the cutting of any shape. The MicroLine 350D features an extremely precise positioning system, permitting a more efficient use of the work surface and setting new standards for the reduction of process times while cutting flex circuits, ceramics, and more.
EPP EUROPE 434
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