Asymtek’s Century C-730 flux-jetting system provides automated, precise application of solder fluxes for a wide range of advanced semiconductor and board assembly processes, offering a robust, high performance alternative to traditional methods such as dipping, stencil printing and ultrasonic spray. The system reportedly maximizes production speed and increases machine utilization by as much as 30%. Many parts can be fluxed at the rate of over 2000UPH, and dice as large as 2x3mm can be fluxed at 1500UPH. The machine is equipped with a DispenseJet valve to provide 100% coverage of the flux area over a range of coating thicknesses with thin film builds as low as 0.004mg/mm2, which translates to a coating thickness of 5 microns for a flux with a density of 0.8kg/l, and as high as 10-times that amount per pass. The thickness can be controlled with precision to provide part tack and good solderability, and to prevent die float. The valve is compatible with cleanable, lead free and no-clean fluxes. The combination of low film builds and precise edge definition minimizes flux residue, enhances part reliability and reduces cleaning. The C-730 is equipped with conveyors and supports SMEMA-compliant interfaces.
EPP EUROPE 451
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