The Indium FB-800 epoxy flux combines the properties of flux and epoxy for ribbon connector SMT applications, in addition to BGA and CSP bumping processes. It is designed specifically for Sn63 and Sn63 eutectic solders, and the VOC-free and halide-free, no-clean flux provides metal surface oxide cleaning during reflow to enhance good solderability. As an epoxy, FB-800 cures after reflow to become a thermosetting polymer layer that surrounds the solder connection. This provides protection against corrosive environments but also reinforcement for solder joints. The material is chemically resistant and will not spread or drip at elevated temperatures, particularly important where excessive heat is generated such as in automotive or high-power devices. In addition, it is compatible with standard underfill materials and conformal coating, and also with most finishes and coatings, such as NiAu, SnPb, Sn, Pd and OSP coatings. The environmentally friendly product, due to the absence of fumes, offers a no-clean soldering solution for assembly of optical devices. It’s available in 10 cc or 30 cc syringes, but other packaging options are also obtainable.
EPP EUROPE 425
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