The 300 mm Wafer Load Port TAS300 ensures a clean environment for wafer manufacturing by securely transferring wafers between parts of the manufacturing process. The Load Port automatically and securely opens and closes the FOUP (front opening unified port) to prevent exposure to dust, resulting in extremely low dusting characteristics. The moving components (including the mapping unit) are housed under the wafer surface, and complete airflow analysis has been carried out to achieve what is arguably the world’s best particle-free system.
As well as guaranteeing a clean environment, the Load Port is compatible with any FOUP, saving valuable time and effort. It is based on TDK’s unequaled stopper design, meaning there is no need to adjust the product for each FOUP vendor. The docking plate and the door’s air-cushion system ensure the secure opening and closing of a variety of FOUPs. TheTAS300 can determine whether the FOUP has been correctly loaded, and detect when it is docked, thereby limiting potential errors. The Load Port complies with SEMI standards, including E47.1 and E62, matching the latest needs of semiconductor manufacturers.
EPP EUROPE 426
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