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    Smtconnect-2022 Rubrik
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    Smtconnect-2022

    5 Artikel

    Aktuelle Smtconnect-2022-Artikel

    Cybord Introduces Level 4+ Component Traceability Verification at SMTConnect 2023

    Cybord Introduces Level 4+ Component Traceability Verification at SMTConnect 2023

    24. August 2026

    Cybord CTO Eyal Weiss presented the company's Level 4+ traceability-as-a-service solution at SMTConnect 2023, leveraging component images captured during assembly to verify supply-chain traceability data.

    Automated Optical Inspection in SMT: Principles, System Architecture and Process Integration

    Automated Optical Inspection in SMT: Principles, System Architecture and Process Integration

    26. Oktober 2026

    Automated Optical Inspection has become an indispensable quality gate in surface-mount assembly lines. Understanding its underlying measurement principles, system variants and integration strategies is essential for engineers seeking robust, zero-defect production.

    Weitere Artikel

    Reflow Soldering: Process Physics, Profile Design and Common Defect MechanismsFoto: Vladislav Klapin / Unsplash

    Reflow Soldering: Process Physics, Profile Design and Common Defect Mechanisms

    23. September 2026

    Reflow soldering remains the dominant joining technology in surface-mount assembly. Understanding the underlying thermal physics, profile architecture and defect causation is essential for achieving consistent,…

    Selective Soldering: Process Fundamentals, Equipment Design and Application CriteriaFoto: Alireza Hatami / Unsplash

    Selective Soldering: Process Fundamentals, Equipment Design and Application Criteria

    14. September 2026

    Selective soldering bridges the gap between reflow and wave soldering, enabling reliable through-hole interconnection on mixed-technology boards without exposing sensitive SMD components to full-wave contact.…

    Solder Paste Inspection: The Critical Gateway to Process Control in SMT AssemblyFoto: Vishnu Mohanan / Unsplash

    Solder Paste Inspection: The Critical Gateway to Process Control in SMT Assembly

    10. September 2026

    Solder paste inspection (SPI) sits at the very beginning of the SMT process chain and determines the quality of every subsequent assembly step. Understanding its measurement principles, key metrics and integration logic…

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