Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Smtconnect-2022/Artikel
    Mirtec to present live demo of 3D Pin inspection system
    Bildquelle nicht angegeben
    Smtconnect-2022

    Mirtec to present live demo of 3D Pin inspection system

    Inspection technology specialist Mirtec will premiere its line of 3D AOI and SPI Inspection Systems in Hall 4A, Stand 128 at the SMTconnect 2022 trade
    Veröffentlicht
    12. April 2022
    Lesezeit
    3 Minuten
    Rubrik
    Smtconnect-2022

    The company will also display its MV-6e OMNI 3D AOI Machine configured with Omni-Vision 3D inspection technology that combines 15 megapixel CoaXPress camera technology with its digital tri-frequency Moiré 3D system.

    Proprietary camera system

    The company’s CoaXPress Vision System is a proprietary camera system designed and manufactured for use with our complete product range of 3D inspection systems. Twelve (12) projection Digital Tri-Frequency Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured, the MV-6 OMNI machines feature four (4) 10 megapixel side-view cameras in addition to the 15 megapixel top-down camera as well as multi-function AOI/SPI inspection capability.

    3D Pin Inspection System

    The company says its new Genesys-PIN 3D Pin Inspection System has been specifically developed for the automotive electronics market. This system is configured with a 12 megapixel CoaXPress high-speed camera system, a 15um precision telecentric lens, an advanced nine (9) phase RGB color lighting system, a programmable multi-focus z-axis system, and four (4) programmable multi-pattern digital projectors which are an integral part of the company’s proprietary hybrid 3D measurement technology.

    With this optical system, the machine can measure up to 50mm tall connector pins with extreme accuracy. It detects defects such as missing pins, pin offset as well as measurement of distance between pins and inner/outer dimensions of forked pins. The machine operates in two different modes: Precision Inspection Mode and High-Speed Inspection Mode. From zero to 12mm there is no difference between modes. If desired, Precision Inspection Mode may be selected to inspect pins in excess of 12mm tall. In this mode, the Programmable Multi-Focus Z-Axis is used to raise the head so that the system can precisely measure pins up to 50mm. On the other hand, in High-Speed Mode, the Z-Axis never moves, and the maximum height measurement is limited to 40mm. High-Speed Inspection Mode is approximately 53% faster when compared to Precision Inspection Mode, however there is a decrease in accuracy for inspection of taller pins.

    AI Powered Smart Factory Automation Solution

    The company also will discuss its comprehensive AI based Smart Factory Automation solution ‘Intelli-Pro’. This technologically-advanced software and algorithm package is specifically designed for the purpose of improving the performance and convenience of the inspection specialist’s complete line of AOI machines. It consists of a proprietary deep learning based automatic part search and teaching function, and ai based: automatic parameter optimization, character recognition (OCR), foreign object detection (FOD), placement inspection algorithms and an automatic defect type classification function.

    Leading the way to Industry 4.0

    The company’s Total Remote Management System (TRMS) is a fully integrated Industry 4.0 Solution which combines remote management with real-time data monitoring and analysis for each system within the SMT production line. It provides real-time remote monitoring of status information and statistical data such as equipment operation status, production yield, PC resources, temperature, humidity, and so on.

    www.mirtec.com

    Mehr aus Smtconnect-2022

    Weitere aktuelle Artikel aus der Rubrik Smtconnect-2022.

    Alle Smtconnect-2022-Artikel
    Automated Optical Inspection in SMT: Principles, System Architecture and Process IntegrationFoto: Ludovico Ceroseis / Unsplash
    Smtconnect-2022

    Automated Optical Inspection in SMT: Principles, System Architecture and Process Integration

    26. Oktober 2026

    Automated Optical Inspection has become an indispensable quality gate in surface-mount assembly lines. Understanding its underlying measurement principles, system variants and integration strategies is essential for…

    Reflow Soldering: Process Physics, Profile Design and Common Defect MechanismsFoto: Vladislav Klapin / Unsplash
    Smtconnect-2022

    Reflow Soldering: Process Physics, Profile Design and Common Defect Mechanisms

    23. September 2026

    Reflow soldering remains the dominant joining technology in surface-mount assembly. Understanding the underlying thermal physics, profile architecture and defect causation is essential for achieving consistent,…

    Selective Soldering: Process Fundamentals, Equipment Design and Application CriteriaFoto: Alireza Hatami / Unsplash
    Smtconnect-2022

    Selective Soldering: Process Fundamentals, Equipment Design and Application Criteria

    14. September 2026

    Selective soldering bridges the gap between reflow and wave soldering, enabling reliable through-hole interconnection on mixed-technology boards without exposing sensitive SMD components to full-wave contact.…

    Solder Paste Inspection: The Critical Gateway to Process Control in SMT AssemblyFoto: Vishnu Mohanan / Unsplash
    Smtconnect-2022

    Solder Paste Inspection: The Critical Gateway to Process Control in SMT Assembly

    10. September 2026

    Solder paste inspection (SPI) sits at the very beginning of the SMT process chain and determines the quality of every subsequent assembly step. Understanding its measurement principles, key metrics and integration logic…

    ← Zurück zu Smtconnect-2022Zur Startseite