Key to streamlining robotic fluid dispensing, vision-guided systems allow precise deposit placement, permitting robotic systems to deliver faster production...
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Mirtec, a leader in inspection technology, has announced the release of a comprehensive AI-based smart factory automation solution called ‘Intelli-Pro’...
Advanced packaging is among the fastest evolving areas of the semiconductor industry. Conventional inspection and quality assurance must be replaced with...
One of the regions hit hardest by the global shortage of chips, the EU has announced it is planning a ‘European Chips Act’ to boost semiconductor research...
The airtight packaging of so-called ‘Front Opening Shipping Boxes’ (FOSB) for the transport of wafers to a semiconductor plant is a complex and...