Vi Technology introduces the Reveal Imager Series, an Automated Optical Inspection (AOI) system for the semiconductor industry which drastically decreases...
AOI & AXI
The manual and semi-automatic heavy wire bonder 5350 from F&K Delvotec, Austria rounds out the equipment range at the lower end and combined a fully...
Modern PCBs with a high packing density and a mixture of SMD and THT components are constantly becoming more complex, increasing the demands placed on...
The increasing functionality and decreasing size of today’s consumer electronics has led to the development of the package-on-package (PoP) technology. Using...
Today, UV-curing chip encapsulants have become an accepted standard in many areas of electronics production. Their short curing times turn these adhesives into...
