Solder joint reliability is an issue which continuously pops-up in the electronic industry. Sekisui has developed a solder ball with a plastic core. While maintaining a gap between substrates, a plastic core helps relax stress caused by CTE (thermal coefficient) mismatch between substrate and chip. Moreover, a copper layer plated on the plastic core secures electric conductivity. Recommended applications are BGAs, CSPs, flip chip and other advanced packages. The solder balls are available in diameters from 100 up to 800 µm.
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