The International Microelectronics and Packaging Society has announced the IMAPSEurope Krakow 2002 Europe-an Microelectronics, Packaging and Interconnection Symposium with exhibition, to be held from 16 to 18 June, at the Sofitel Hotel, Krakow, Poland. The technical program is planned to include the following key topics: assembly technologies (adhesives, Pb-free, SMT, etc.); electrical, thermal and mechanical Design; modeling and simulation; environmentally friendly manufacture and products; diagnostics, quality, applications and reliability; materials (ceramic, polymeric, composites and films; packaging and interconnection (HD, encapsulants, MEMS, optoelectronics); passive integrated components and functional MCMs.
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