At Semicon Taiwan, Henkel showcased a range of semiconductor packaging material solutions designed to foster discussions that will help address application challenges. With recently launched innovations for high-reliability advanced packaging and wirebond devices, the company offers solutions for demanding package designs used in the automotive, industrial, and high-performance computing sectors.
“The semiconductor industry is central to nearly all technology development and to solving some of the world’s biggest challenges,” said Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran Trichur. “Henkel is a key contributor to this progress, delivering cutting-edge semiconductor packaging materials for high reliability automotive packaging, AI and high-performance computing, and evolving industrial applications.”
From power ICs to microcontrollers to sensors, the devices that make modern vehicles more electrified, safe, and connected require materials with robust processing capability and exceptional in-field performance. The company says its high thermal die attach adhesive Loctite Ablestik 6395T and pressure-less sintering material Loctite Ablestik 8068TI deliver the highest standard automotive grade 0 reliability and are compatible with various leadframe finishes, including Cu.
Its formulations Loctite Ablestik CDF 200P and Loctite Ablestik CDF 600P offer the inherent benefits of conductive die attach film – tight bondline control, consistent fillet formation, no die tilt, and no resin bleed – and are distinguished by their different thermal and electrical conductivities, as well as die size compatibility. Henkel’s conductive die attach film materials are widely used for automotive microcontroller unit packages such as QFPs and TSSOPs.
Next-generation processors are integrating the most advanced Si node flip chips, and protecting them against thermomechanical stress is vital to their reliability. Last year, the adhesives specialist introduced a capillary underfill, Loctite Eccobond UF 9000AG, that balances high filler loading and fast flow capability. This combination helps packaging specialists meet volume production while ensuring excellent protection of chip interconnects.
“The converging demands of miniaturization, high performance, functionality, and extremely high reliability make semiconductor device innovation more complex than ever. We are helping our customers meet the challenges head-on with materials that allow them to confidently push the reliability envelope,” added Ramachandran Trichur.
