Finetech introduces the new Fineplacer Sigma bonder, designed to provide a solution for large die up to 100 mm, combined with a working area of 450 x 300 mm. The bonder is ideally suited for high-density array applications and high bond force (up to 1000 N) requirements, coupled with Finetech’s renowned sub-micron placement accuracy.
The system is the ideal choice for a wide variety of Wafer Level Packaging (FOWLP, W2W, C2W) with high bump count used to assemble MEMS/MOEMS, IR/ image sensors, focal plane arrays, and high power device packaging. This includes assembly of complex 2.5D and 3D IC packages that require high accuracy across the entire surface of large substrates. The bonder can also pick up from and bond to 300 mm wafers.
The cornerstone element of the new bonder is FPXvision, the newest generation of the company‘s Vision Alignment Systems (VAS). It provides the highest resolution at all magnification levels and real-time optimized camera images. It enables the smallest devices and features to be clearly observed across the entire field of view, even with large components and substrates. Touch screen magnifiers allow zoomed images anywhere in the field of view. Two high definition cameras and specially developed optics ensure that the cameras’ full resolution potential is tapped. FPXvision is the first vision system to introduce pattern recognition to a semi-automated die bonding platform.
The bonder allows endless fields of application to users working with medical technologies, RD, mil/aero, semiconductor, and automotive industries. The optimal process environment can be configured for each type of application, including the latest technologies such as vacuum bonding, sintering or metal diffusion (Cu/Cu).
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