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Werner Wirth: Advantages of component protection with hotmelt molding

Potting instead of housing
Werner Wirth: Advantages of component protection with hotmelt molding

Electronics are used almost everywhere today and are particularly exposed to light, moisture, temperature fluctuations, vibrations and corrosion. Although such housings offer reliable protection, they are rigid and inflexible. As a result, they often do not make a good figure. This is where Werner Wirth come in. The company has been one of the think tanks in the electronics industry for over 40 years. An industry that is growing ever faster and in which the components continue to shrink.

» Bernd Conrad, Business Development Manager, Werner Wirth Group

The Werner Wirth Group, based in Hamburg, is the only company in the electronics industry that specializes in connection technology and component protection from a single source. As a manufacturer of automated systems, toolmaker and material supplier, the company is a reliable competence and solution partner for demanding, customer-specific applications in all industries.

Reducing environmental impacts

Agriculture, for example, is a sector that is massively affected by external environmental influences. Hotmelt molding is perfect in agriculture since machines or electronics are subject to different weather conditions every day. It provides reliable and long-lasting protection against moisture, temperature fluctuations, corrosion and vibrations. 

In today‘s agriculture in particular, the requirements are increasing both in terms of costs and economy as well as environmental protection. The question that arises more and more often is how to increase productivity while complying with the necessary ecological norms. A central point here is the consistent use of the areas and the simultaneous reduction of environmentally harmful additives. Modern agricultural machines do not simply drive in the fields but analyze the area and the necessary consumption of seeds and fertilizers before use. Unnecessary travel times and distances are avoided by using GPS systems.

Even if the space possibilities seem endless, the following also applies here: the smaller the better. An effective project implementation dispenses with an additional housing from the outset. Rather, it uses the advantage of component protection with hotmelt molding. This process saves time and money. The housing and complex component potting are no longer required.

Electronic component protection

In hotmelt molding, the assembly is enveloped with a material in a single step, creating a housing structure and protecting the assembly at the same time. The electronics are not damaged because the low-viscosity, thermoplastic materials have a low processing temperature.

It is hard to imagine better protection for electronic components. Hotmelt molding provides reliable and long-lasting protection. 1K thermoplastic Thermelt casting materials are used for this process. It is melted in a tank device or extruder and then filled into the mold. Exactly at that point in time, i.e. in the mold, the product receives its supporting and shaping encapsulation. This individually adapted potting only requires very short process times.

The following factors need to be considered when selecting the material: softening points, operating temperatures, adhesive properties, chemical resistance and burning behavior.

At Werner Wirth, the right equipment is available for every application. There is an extensive machine program, from stand-alone systems to in-line systems. Tank systems, extruder technology and drum melters are available for processing the material.

Company contact

Hellgrundweg 111
22525 Hamburg Germany
Tel.: +49 40 75 24 91–0
E-Mail: info@wernerwirth.de
Website: www.wernerwirth.de


Für Elektronik, die täglich unterschiedlichen Witterungsverhältnissen unterliegt, eignet sich Komponentenschutz mit Hotmelt Moulding, bei dem in einem Arbeitsschritt die Baugruppe mit einem Material umhüllt wird und so zum Schutz eine Gehäusestruktur entsteht.


La protection du composant avec enduction sous fusion (Hotmelt molding) enrobant le module électronique avec un matériau en une seule étape et créant une enveloppe de protection, est parfaitement adaptée pour les composants électroniques qui sont soumis quotidiennement à des conditions météorologiques diverses.


Для электроники, которая ежедневно подвергается воздействию различных погодных условий, подходит защита компонентов с помощью термоплавких материалов. При этом узел в один этап покрывается материалом, формирующим структуру защитного корпуса.

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