Manufacturer of polyimide epoxy laminates and prepregs and thermal management and IMS solutions Ventec International has expanded its range of hydrocarbon-based PCB materials with the introduction of the new tec-speed 20.0 VTM1000i hydrocarbon laminate. “Offering impressive thermal reliability and exceptionally high Dk (9.8) and low Df (0.0023) typically seen only in PTFE materials, this next generation hydrocarbon laminate presents the industry with a lower budget solution for high-end RF applications, including satellite communications and 5G RF use,” the company said.
Designed for antenna and communication systems, radar, and aviation systems, the new material is available in a range of dielectric thickness, with 0.38 mm through to 3.81 mm options and offers high decomposition temperature (Td) of 426°C.
Providing considerable power integrity benefits, the high Dk value (9.8 ± 0.0245 @ 10 Ghz) provides larger interplanar capacitance than other hydrocarbon laminates in this range, offering an alternative option for specific application in the microwave and RF industry previously available only through more costly PTFE laminates.
Manufactured at the company’s facilities in Taiwan and China, the material is available worldwide.
“At Ventec we are constantly refining and improving our range to help our customers achieve their special and future performance goals. tec-speed 20.0 VTM1000i represents a top-tier option for use with satellite communications systems, GPS antennas, and other RF and microwave circuitry, and is an important addition to our tec-speed range,” commented Jason Chung, CEO of Ventec International Group. “We will be showcasing this new laminate worldwide at events throughout 2023.”
The company will debut the new hydrocarbon laminate at the IPC APEX Expo 2023 in San Diego at Booth 419.