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Ventec debuts high thermal conductive metal base laminate for IGBT & power markets

High performance thermal management
Ventec debuts high thermal conductive metal base laminate for IGBT & power markets

Ventec debuts high thermal conductive metal base laminate for IGBT & power markets
The company says the new laminate has excellent mechanical properties, dimensional stability, and superior dielectric properties Source: Ventec International

Ventec International Group has launched a high thermal conductive metal base laminate VT-4BC designed for use in applications requiring excellent performance in thermal management including super bright lighting, power modules, controllers, motor drives and rectifiers. With high electrical breakdown strength, the product is designed to provide unparalleled reliability and improved performance over competing materials. It exhibits a thermal conductivity of 10 W/mK, offering superior heat dissipation even under the most demanding conditions.

In addition to its exceptional thermal performance, the laminate also boasts excellent mechanical properties, dimensional stability, and superior dielectric properties. It is also resistant to impact, moisture, and chemicals, making it a reliable choice for the most demanding applications particularly for IGBT and power markets.

The material will make its US debut at IPC APEX Expo 2023 from 24–26 January in San Diego, where visitors to booth 419 can discover the superior performance of VT-4BC alongside the full range of PCB base materials.

“We are proud to introduce a product that provides unparalleled thermal performance and highest electrical breakdown strength,” the company’s Global Head IMS Technology, Chris Hanson commented. “VT-4BC is designed for customers who value reliability and require improved performance over traditional materials. We look forward to showcasing it at IPC APEX Expo in January, where attendees can discover its superior capabilities firsthand.”

www.venteclaminates.com

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