SurfX Technologies will be focusing on its revolutionary flux-free flip chip and hybrid wafer bonding technologies at this year’s Productronica event, showcasing its commitment to advancing semiconductor manufacturing processes. Two manufacturers will represent Surfx Technologies solutions at the expo this year.
Novel-Technology Transfer, B1.916
Visit the Novel-Technology Transfer booth to see Surfx Technologies‘ flagship product, the STA-10iL automated plasma machine, in action. This machine is configured for cleaning and oxide removal from 300mm wafers. Live demonstrations will highlight the effectiveness of the machine in providing flux-free cleaning solutions for semiconductor wafers.
A video reel will also be presented, showcasing the STW wafer cleaning tool and various Atmospheric Argon Plasma cleaning applications tailored to the semiconductor industry. This multimedia presentation will provide attendees with a comprehensive understanding of the wide-ranging capabilities in surface treatment.
Bentec, A3.120
Bentec will have dedicated a section of its booth to showcasing Surfx’s Atomflo atmospheric surface plasma treatment technology.
“We are excited to be part of productronica 2023 and to have the opportunity to showcase our flux-free flip chip and hybrid wafer bonding technologies,” said Robert Hicks, President & CEO at Surfx Technologies. “Our presence at this event reflects our dedication to advancing semiconductor manufacturing processes and providing our customers with the most reliable and effective surface treatment solutions.”
