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Surfx Technologies to present in-line plasma cleaning and flux-free flip chip bonding

IPC Apex Expo 2022
Surfx Technologies to present in-line plasma cleaning and flux-free flip chip bonding

Surfx_STA-10.jpg
The company will demonstrate its ST Series automated systems, including the STA-10iL Automated Plasma Machine and STA-10iL-6HPD Atmospheric Plasma System Source: Surfx Technologies

Surfx Technologies, suppliers of atmospheric plasma, will exhibit in Booth #1302 at the IPC Apex Expo (25–27 January 2022 at the San Diego Convention Center in California). The company will demonstrate its ST Series automated systems, including the STA-10iL Automated Plasma Machine and STA-10iL-6HPD Atmospheric Plasma System.

“Surfx Technologies’ most versatile platform, the STA-10iL in-line atmospheric pressure plasma system is designed for high volume manufacturing,” the company said. “The system’s versatile conveyor design allows for rapid surface preparation of electronics, including all types of IC packages. Whether for cleaning dies, silicon wafers, medical devices or molded plastic parts, the STA-10iL can be easily configured for any job with a working volume of 550 x 760 x 60 mm.

“The STA-10iL offers a slim footprint, fast lead times and flexible configurations, leaving no excuse to skip plasma surface preparation for critical processes. Save money and improve quality with turnkey systems configured for your application.

“Flip chips are becoming smaller and thinner. This trend means finer pitches and reduced clearance in the assembly process. Flux residues cannot be fully removed from BGAs with pitches below 0.5 micron. Flux alternatives, such as formic acid, require even higher process temperatures, compromising package stability. A new solution for oxide removal is required to continue industry trajectory, so Surfx has responded with the introduction of the STA-10iL-6HPD Atmospheric Plasma System.

“Surfx plasma eliminates the need for flux. The STA-10iL-6HPD is designed for BGA and LGA cleaning prior to bonding in advanced semiconductor packages. This technology is effective on copper, indium and tin, and can be used standalone or integrated into the bonder.”

The company adds that its argon plasma systems clean and activate a wide variety of material surfaces, including glass, ceramics, polymers, semiconductors and metals.

www.surfxtechnologies.com

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