Alpha, a global leading materials supplier, introduces a new preform product into the market, to improve assembly yield when using large BGA devices. The product also has usability by enabling reflow soldering of some types of through-hole devices, making it a truly versatile offering. Named for their precise height control and burr free edges, these non-collapse disc spacers mitigate corner solder bridging caused by BGA warping during SMT reflow. The spacer blocks are offered in tape and reel packaging for automatic placement with excellent pick rate yield.
“Prior to production, extensive studies were conducted at a large network equipment provider to optimize assembly features and spacer height requirements,” said Jerry Sidone, Senior Technical Marketing Engineer. “Most importantly, we were able to validate the effectiveness of TrueHeight Spacer Blocks in mitigating corner solder bridging through process yield data provided by the customer.”
The TrueHeight Spacer Blocks also aid in intrusive reflow applications where there is either no standoff function or inadequate clearance under through-hole components. They raise the component off the PCB, allowing the solder to reflow freely to achieve 100% hole fill.
“For customers looking to replace wave solder operations with intrusive reflow, this technology enables the use of off the shelf through-hole components not necessarily intended for reflow, brings them one step closer to achieving an elimination-of-wave assembly floor.” said Paul Koep, Global Product Manager for Preforms.
Features and benefits of the Spacer Blocks include:
- Non-collapse spacer function
- Burr free construction
- Precise height control – only + 0.010mm
- Tape & reel packaging for easy integration into standard assembly
- Improves yield
- Reduces processing costs
- Long-term reliability
Share:
