Sonoscan has unveiled some of the details that enable its powerful new software tool to perform acoustic imaging to identify anomalies and defects in stacked die configurations. The key problem of imaging interfaces in a stack is that ultrasound pulsed into the stack by the C-SAM system’s transducer is reflected from such a large number of internal interfaces. If there are eight die, then there are at least 17 interfaces and numerous multiple reflections. The real value of the new software is that it can sort out the right echoes and provide the acoustic imaging accuracy that lets manufacturers build high reliability into their die stacks.
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