Thanks to its modular system architecture, the Fineplacer matrix from Finetech is an assembly and rework station capable of a wide range of applications to ensure compatibility with future technology developments. The system provides a working area of 460 mm x 390 mm or wafers of up to 12“, an outstanding placement accuracy of better than 3 µm, closed-loop force control, automated process operation and the ability of system-to-system process transfers, such as from R&D to production. The ergonomic design and intuitive operability, combined with simple servicing and maintenance access, further emphasizes Finetech’s guiding principle of designing a machine that is aligned with the needs of the user. In the rework configuration, the system offers the particularly powerful hot air bottom heating RB30 and sets a new standard in the rework of large multilayer boards. Since its introduction a year ago, the Fineplacer core has been firmly established in the market. The system allows for safe rework of virtually the full bandwidth of typical SMD components with chip sizes ranging from 0.25 mm to 50 mm on board sizes up to 400 mm x 300 mm. It is based on superior and proven hot air soldering technology. In order to ensure a very gentle heat transfer, the intelligent thermal management is comprised of the coordinated control of all process and environment variables as well as the harmonized interaction of top and bottom heating. With respect to components and board size, only the necessary heat is being conveyed. For optimized soldering results, the system supports the use of nitrogen and other process gases. The compact design does not compromise with respect to its functional range either. Quite on the contrary, it efficiently supports all functionalities of a future-proof rework system.
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