Solderstar, a leading supplier of temperature profiling equipment for reflow, wave, vapour, and selective soldering, will demonstrate its latest technological advancements at the Productronica expo in Munich taking place from 14-17 November 2023. The company will also reveal its new soldering process control technology which it says is poised to transform the measurements of advanced soldering applications.
At the forefront of the showcase is the Reflow Shuttle, a solution designed to transform reflow process verification. The system offers precise measurement of critical reflow parameters, bringing unprecedented accuracy and insight into the soldering process, and provides a comprehensive set of features to address the complexities of modern reflow environments. It utilises an array of independent sensors to measure top and bottom temperature profiles, providing a comprehensive view of the reflow oven‘s performance. This detailed data allows engineers to fine-tune and optimise soldering processes with unparalleled precision. In addition to temperature profile verification, the system assesses zone heater uniformity, ensuring that heat is evenly distributed across the soldering environment, reducing the risk of defects and improving product quality. Understanding the impact of vibration is crucial in soldering processes, and the Reflow Shuttle captures process vibration in X, Y, and Z axes, allowing engineers to analyse and mitigate the effects of machine vibrations on product quality. Furthermore, the Reflow Shuttle provides insights into conveyor performance by measuring line speed, helping manufacturers maintain consistent production rates and product quality. For processes that involve vacuum stages, the company says the shuttle offers an optional measurement module to verify vacuum levels down to 10 mbar. It automatically calculates hold time below the desired vacuum level and monitors pull-down and release rates, ensuring precise control over the soldering environment.
“In today‘s intricate reflow environments, conventional temperature-based measurements are inadequate,” Mark Stansfield, CEO at Solderstar, said. “The Reflow Shuttle provides an all-encompassing solution, offering temperature data and vital insights into heater uniformity, vibration, line speed, and vacuum levels. This gives engineers comprehensive insights into their soldering processes, enhancing product quality and efficiency.
“We are looking forward to welcoming visitors to our stand at Productronica, where we will showcase our latest cutting-edge technologies and introduce an exciting new product that promises to make a significant impact.”
The Reflow Shuttle is engineered for ease of use, enabling machine operators to collect data independently and reducing dependence on specialised engineering personnel. Seamless integration with Solderstar‘s Shuttle Central software streamlines data collection and analysis, optimising efficiency.
Also taking centre stage on the stand is the zero set-up SLX thermal profiler. SLX is an accurate, robust, ultra-compact, battery-powered datalogger used for measuring and recording process parameters from any soldering process. The SLX unit can be docked onto any SMARTLink reflow heatshield or other process accessory, and the system will auto-configure itself for data capture.
Visitors to Productronica, taking place from 14–17 November, Munich, Germany, are invited to explore these ground-breaking solutions at Solderstar‘s Stand A4.246/4. The company‘s team of experts will be on hand to provide detailed insights, live demonstrations, and answers to technical enquiries.
Booth A4.246/4
