AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, highlighted their new NC520and NC273LT solder pastes at SMT Hybrid Packaging 2014 in Nuremburg, Germany.
The newly developedNC520 is a no clean, halogen-free solder paste designed for the most demanding high density electronic assemblies. It offers excellent wetting, improved printing and reduces voiding. The superior wetting ability results in bright, smooth and shiny solder joints. Consistent transfer efficiencies reduce head-in-pillow defects even when component/substrate co-planarity is not optimal.
The NC273LT solder paste for bismuth containing alloys provides assemblers with an innovative solution when temperature sensitivity is critical. This new solder paste contains a revolutionary activator system that improves the wetting performance of bismuth alloys to RoHS compliant plating and surface finishes. The solder paste minimizes solder balling, a defect common to high bismuth materials. The company offers locally made solder paste, bar solder, wire solder, and liquid flux throughout Europe with manufacturing and stocking locations in Poland, Italy, and Spain.
In addition to their two new solder paste products, the company highlighted its complete line of solder paste, liquid fluxes, tin/lead and lead-free alloys, and specialty alloys.
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